According to LookWhole Insight, the global Semiconductor Heat Treatment Equipment market is projected to reach USD 186.82 Million in 2024. It is expected to grow to USD 307.16 Million by 2033, registering a compound annual growth rate (CAGR) of 5.68% during the forecast period (2024–2033). - LookWhole Insight
Global Semiconductor Heat Treatment Equipment Market Size: 2024-2033
Source: LookWhole Insight, 2025
Semiconductor Heat Treatment Equipment Market Analysis
Semiconductor Heat Treatment Equipment, also known as furnace tube equipment or Semiconductor Thermal Treatment Equipment, is a general term for a type of equipment related to heat treatment, including oxidation furnaces, diffusion furnaces, annealing furnaces, rapid annealing (RTP) furnaces, etc. If the equipment is divided by form, furnace tube equipment can be divided into three categories: horizontal furnaces, vertical furnaces and rapid thermal processing furnaces.
The names of horizontal furnaces and vertical furnaces come from the difference in the form of the reaction chamber. Vertical furnaces are currently more widely used because they occupy a small space and are more controllable. Both horizontal furnaces and vertical furnaces heat up and cool down the cavity together with the silicon wafers placed in it, so the heating and cooling rate is slow; rapid thermal processing furnaces only change the temperature of the wafers in them without changing the temperature of the cavity, so rapid annealing can be performed. Horizontal furnaces and vertical furnaces can place 100-200 wafers at a time, and rapid thermal processing furnaces can only process single wafers.
The development of the Semiconductor Heat Treatment Equipment market is driven by multiple key factors. The continuous expansion of semiconductor nodes and the increasingly complex process of integrated circuit manufacturing have increased the demand for precise thermal control and high uniformity in processes such as oxidation, diffusion and annealing. This technological advancement has driven the growing preference for advanced vertical furnaces and rapid thermal processing (RTP) systems, which can provide better process control, higher space efficiency and higher yields. At the same time, the expansion of global wafer foundries and IDM (integrated device manufacturers) capacity, especially in Asia Pacific regions such as mainland China, Taiwan and South Korea, has stimulated strong demand for thermal processing tools for all technology nodes. In addition, the rise of emerging technologies such as 5G, automotive electronics and AI chips has made thermal processing processes increasingly complex, further driving equipment upgrades and market growth.
Key Development Trends
Source: Secondary Sources and LOOKWHOLE INSIGHT,2025
Global Semiconductor Heat Treatment Equipment Market: Competitive Landscape
According to the LookWhole Insight report, the Semiconductor Heat Treatment Equipment market presents a competitive landscape with varying degrees of competition in its segments. In the broader thermal processing equipment market, relatively low technical barriers allow many companies to participate. This has led to a fragmented competitive landscape with numerous global and regional players. Despite this fragmentation, companies such as Applied Materials, Tokyo Electron, and Hitachi Kokusai Electric have maintained strong positions with their mature technologies, extensive customer networks, and continuous innovation.
The rapid thermal processing (RTP) segment is oligopolistic, with Applied Materials and China's Yitong Holdings dominating with a combined market share of approximately 80%. This concentrated control reflects the high technical barriers and specialized R&D capabilities required to develop and manufacture RTP systems, which require precise temperature control, uniformity, and speed. The dominance of these two companies limits the competitive maneuverability of other players and raises barriers to entry, especially for companies that lack advanced technology platforms or strong customer integration capabilities.
Market Report Coverage & Segmentation
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ATTRIBUTE |
Details |
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Time Coverage |
Historical Year: 2020– 2024 Base Year: 2024 Estimated Year: 2025 Forecast Year: 2025 - 2033 |
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Market Segmentation |
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By Type |
Horizontal Furnace Vertical Furnace Rapid Thermal Processing Furance (RTP) |
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By Application |
Semiconductor Manufacturing Solar Energy Production MEMS Fabrication Others |
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By Company |
Applied Materials, Inc. Kokusai Electric Corporation Tokyo Electron JTEKT Thermo Systems Corporation E-Town Semiconductor NAURA Technology Group Co., Ltd. Shenzhen S.C New Energy Technology Corporation Thermco Systems Veeco ASM International Ideal Deposition Laplace Energy Technology SCREEN Semiconductor Solutions Co., Ltd. Centrotherm KLA Corporation ACM Research BTU International Tempress Ohkura Electric China Electronics Technology Group SVCS Process Innovation s.r.o SEMCO Technologies Others |
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By Region |
North America |
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