Definition and Scope: Chip level underfill adhesives are specialized materials used in the semiconductor industry to enhance the reliability and performance of electronic devices. These adhesives are applied between the semiconductor chip and the substrate to provide mechanical support, thermal management, and protection against external factors such as moisture and mechanical stress. Chip level underfill adhesives are designed to flow under the chip by capillary action and cure to form a strong and durable bond. They play a crucial role in improving the overall quality and lifespan of electronic products, making them essential components in the manufacturing process of various electronic devices. The market for chip level underfill adhesives is experiencing significant growth due to several key market trends and drivers. One of the primary factors driving market growth is the increasing demand for smaller and more powerful electronic devices such as smartphones, tablets, and wearables. As electronic devices continue to shrink in size and increase in complexity, the need for advanced underfill adhesives that can provide superior performance in a compact form factor is rising. Additionally, the growing adoption of advanced packaging technologies such as flip-chip and wafer-level packaging is fueling the demand for high-performance underfill adhesives that can meet the stringent requirements of these applications. Moreover, the expansion of the automotive electronics industry and the development of 5G technology are also contributing to the growth of the chip level underfill adhesives market. In addition to these trends, the market for chip level underfill adhesives is being driven by technological advancements in material science and manufacturing processes. Manufacturers are continuously innovating to develop underfill adhesives with improved thermal conductivity, mechanical strength, and reliability to meet the evolving needs of the semiconductor industry. Furthermore, the increasing focus on sustainability and environmental regulations is prompting companies to develop eco-friendly underfill adhesive formulations that reduce the environmental impact of electronic waste. Overall, the market for chip level underfill adhesives is poised for steady growth as the demand for high-performance electronic devices continues to rise, driving the need for advanced materials that can enhance product reliability and performance. The global Chip Level Underfill Adhesives market size was estimated at USD 613.74 million in 2024, exhibiting a CAGR of 6.00% during the forecast period. This report offers a comprehensive analysis of the global Chip Level Underfill Adhesives market, examining all key dimensions. It provides both a macro-level overview and micro-level market details, including market size, trends, competitive landscape, niche segments, growth drivers, and key challenges. Report Framework and Key Highlights: Market Dynamics: Identification of major market drivers, restraints, opportunities, and challenges. Trend Analysis: Examination of ongoing and emerging trends impacting the market. Competitive Landscape: Detailed profiles and market positioning of major players, including market share, operational status, product offerings, and strategic developments. Strategic Analysis Tools: SWOT Analysis, Porter’s Five Forces Analysis, PEST Analysis, Value Chain Analysis Market Segmentation: By type, application, region, and end-user industry. Forecasting and Growth Projections: In-depth revenue forecasts and CAGR analysis through 2033. This report equips readers with critical insights to navigate competitive dynamics and develop effective strategies. Whether assessing a new market entry or refining existing strategies, the report serves as a valuable tool for: Industry players Investors Researchers Consultants Business strategists And all stakeholders with an interest or investment in the Chip Level Underfill Adhesives market. Global Chip Level Underfill Adhesives Market: Segmentation Analysis and Strategic Insights This section of the report provides an in-depth segmentation analysis of the global Chip Level Underfill Adhesives market. The market is segmented based on region (country), manufacturer, product type, and application. Segmentation enables a more precise understanding of market dynamics and facilitates targeted strategies across product development, marketing, and sales. By breaking the market into meaningful subsets, stakeholders can better tailor their offerings to the specific needs of each segment—enhancing competitiveness and improving return on investment. Global Chip Level Underfill Adhesives Market: Market Segmentation Analysis The research report includes specific segments by region (country), manufacturers, Type, and Application. Market segmentation creates subsets of a market based on product type, end-user or application, Geographic, and other factors. By understanding the market segments, the decision-maker can leverage this targeting in the product, sales, and marketing strategies. Market segments can power your product development cycles by informing how you create product offerings for different segments. Key Companies Profiled Henkel Won Chemical NAMICS Showa Denko Panasonic MacDermid (Alpha Advanced Materials) Shin-Etsu Sunstar Fuji Chemical Zymet Shenzhen Dover Threebond AIM Solder Darbond Technology Master Bond Hanstars Nagase ChemteX LORD Corporation Asec Co. Ltd. Everwide Chemical Bondline Panacol-Elosol United Adhesives U-Bond Shenzhen Cooteck Electronic Material Technology Market Segmentation by Type Chip-on-film Underfills Flip Chip Underfills CSP/BGA Board Level Underfills Market Segmentation by Application Industrial Electronics Defense & Aerospace Electronics Consumer Electronics Automotive Electronics Medical Electronics Others Geographic Segmentation North America: United States, Canada, Mexico Europe: Germany, France, Italy, U.K., Spain, Sweden, Denmark, Netherlands, Switzerland, Belgium, Russia. Asia-Pacific: China, Japan, South Korea, India, Australia, Indonesia, Malaysia, Philippines, Singapore, Thailand South America: Brazil, Argentina, Colombia. Middle East and Africa (MEA): Saudi Arabia, United Arab Emirates, Egypt, Nigeria, South Africa, Rest of MEA Report Framework and Chapter Summary Chapter 1: Report Scope and Market Definition This chapter outlines the statistical boundaries and scope of the report. It defines the segmentation standards used throughout the study, including criteria for dividing the market by region, product type, application, and other relevant dimensions. It establishes the foundational definitions and classifications that guide the rest of the analysis. Chapter 2: Executive Summary This chapter presents a concise summary of the market’s current status and future outlook across different segments—by geography, product type, and application. It includes key metrics such as market size, growth trends, and development potential for each segment. The chapter offers a high-level overview of the Chip Level Underfill Adhesives Market, highlighting its evolution over the short, medium, and long term. Chapter 3: Market Dynamics and Policy Environment This chapter explores the latest developments in the market, identifying key growth drivers, restraints, challenges, and risks faced by industry participants. It also includes an analysis of the policy and regulatory landscape affecting the market, providing insight into how external factors may shape future performance. Chapter 4: Competitive Landscape This chapter provides a detailed assessment of the market's competitive environment. It covers market share, production capacity, output, pricing trends, and strategic developments such as mergers, acquisitions, and expansion plans of leading players. This analysis offers a comprehensive view of the positioning and performance of top competitors. Chapters 5–10: Regional Market Analysis These chapters offer in-depth, quantitative evaluations of market size and growth potential across major regions and countries. Each chapter assesses regional consumption patterns, market dynamics, development prospects, and available capacity. The analysis helps readers understand geographical differences and opportunities in global markets. Chapter 11: Market Segmentation by Product Type This chapter examines the market based on product type, analyzing the size, growth trends, and potential of each segment. It helps stakeholders identify underexplored or high-potential product categories—often referred to as “blue ocean” opportunities. Chapter 12: Market Segmentation by Application This chapter analyzes the market based on application fields, providing insights into the scale and future development of each application segment. It supports readers in identifying high-growth areas across downstream markets. Chapter 13: Company Profiles This chapter presents comprehensive profiles of leading companies operating in the market. For each company, it details sales revenue, volume, pricing, gross profit margin, market share, product offerings, and recent strategic developments. This section offers valuable insight into corporate performance and strategy. Chapter 14: Industry Chain and Value Chain Analysis This chapter explores the full industry chain, from upstream raw material suppliers to downstream application sectors. It includes a value chain analysis that highlights the interconnections and dependencies across various parts of the ecosystem. Chapter 15: Key Findings and Conclusions The final chapter summarizes the main takeaways from the report, presenting the core conclusions, strategic recommendations, and implications for stakeholders. It encapsulates the insights drawn from all previous chapters. Table of Contents 1 Introduction to Research & Analysis Reports 1.1 Chip Level Underfill Adhesives Market Definition 1.2 Chip Level Underfill Adhesives Market Segments 1.2.1 Segment by Type 1.2.2 Segment by Application 2 Executive Summary 2.1 Global Chip Level Underfill Adhesives Market Size 2.2 Market Segmentation – by Type 2.3 Market Segmentation – by Application 2.4 Market Segmentation – by Geography 3 Key Market Trends, Opportunity, Drivers and Restraints 3.1 Key Takeway 3.2 Market Opportunities & Trends 3.3 Market Drivers 3.4 Market Restraints 3.5 Market Major Factor Assessment 4 Global Chip Level Underfill Adhesives Market Competitive Landscape 4.1 Global Chip Level Underfill Adhesives Sales by Manufacturers (2020-2025) 4.2 Global Chip Level Underfill Adhesives Revenue Market Share by Manufacturers (2020-2025) 4.3 Chip Level Underfill Adhesives Market Share by Company Type (Tier 1, Tier 2, and Tier 3) 4.4 New Entrant and Capacity Expansion Plans 4.5 Mergers & Acquisitions 5 Global Chip Level Underfill Adhesives Market by Region 5.1 Global Chip Level Underfill Adhesives Market Size by Region 5.1.1 Global Chip Level Underfill Adhesives Market Size by Region 5.1.2 Global Chip Level Underfill Adhesives Market Size Market Share by Region 5.2 Global Chip Level Underfill Adhesives Sales by Region 5.2.1 Global Chip Level Underfill Adhesives Sales by Region 5.2.2 Global Chip Level Underfill Adhesives Sales Market Share by Region 6 North America Market Overview 6.1 North America Chip Level Underfill Adhesives Market Size by Country 6.1.1 USA Market Overview 6.1.2 Canada Market Overview 6.1.3 Mexico Market Overview 6.2 North America Chip Level Underfill Adhesives Market Size by Type 6.3 North America Chip Level Underfill Adhesives Market Size by Application 6.4 Top Players in North America Chip Level Underfill Adhesives Market 7 Europe Market Overview 7.1 Europe Chip Level Underfill Adhesives Market Size by Country 7.1.1 Germany Market Overview 7.1.2 France Market Overview 7.1.3 U.K. Market Overview 7.1.4 Italy Market Overview 7.1.5 Spain Market Overview 7.1.6 Sweden Market Overview 7.1.7 Denmark Market Overview 7.1.8 Netherlands Market Overview 7.1.9 Switzerland Market Overview 7.1.10 Belgium Market Overview 7.1.11 Russia Market Overview 7.2 Europe Chip Level Underfill Adhesives Market Size by Type 7.3 Europe Chip Level Underfill Adhesives Market Size by Application 7.4 Top Players in Europe Chip Level Underfill Adhesives Market 8 Asia-Pacific Market Overview 8.1 Asia-Pacific Chip Level Underfill Adhesives Market Size by Country 8.1.1 China Market Overview 8.1.2 Japan Market Overview 8.1.3 South Korea Market Overview 8.1.4 India Market Overview 8.1.5 Australia Market Overview 8.1.6 Indonesia Market Overview 8.1.7 Malaysia Market Overview 8.1.8 Philippines Market Overview 8.1.9 Singapore Market Overview 8.1.10 Thailand Market Overview 8.1.11 Rest of APAC Market Overview 8.2 Asia-Pacific Chip Level Underfill Adhesives Market Size by Type 8.3 Asia-Pacific Chip Level Underfill Adhesives Market Size by Application 8.4 Top Players in Asia-Pacific Chip Level Underfill Adhesives Market 9 South America Market Overview 9.1 South America Chip Level Underfill Adhesives Market Size by Country 9.1.1 Brazil Market Overview 9.1.2 Argentina Market Overview 9.1.3 Columbia Market Overview 9.2 South America Chip Level Underfill Adhesives Market Size by Type 9.3 South America Chip Level Underfill Adhesives Market Size by Application 9.4 Top Players in South America Chip Level Underfill Adhesives Market 10 Middle East and Africa Market Overview 10.1 Middle East and Africa Chip Level Underfill Adhesives Market Size by Country 10.1.1 Saudi Arabia Market Overview 10.1.2 UAE Market Overview 10.1.3 Egypt Market Overview 10.1.4 Nigeria Market Overview 10.1.5 South Africa Market Overview 10.2 Middle East and Africa Chip Level Underfill Adhesives Market Size by Type 10.3 Middle East and Africa Chip Level Underfill Adhesives Market Size by Application 10.4 Top Players in Middle East and Africa Chip Level Underfill Adhesives Market 11 Chip Level Underfill Adhesives Market Segmentation by Type 11.1 Evaluation Matrix of Segment Market Development Potential (Type) 11.2 Global Chip Level Underfill Adhesives Sales Market Share by Type (2020-2033) 11.3 Global Chip Level Underfill Adhesives Market Size Market Share by Type (2020-2033) 11.4 Global Chip Level Underfill Adhesives Price by Type (2020-2033) 12 Chip Level Underfill Adhesives Market Segmentation by Application 12.1 Evaluation Matrix of Segment Market Development Potential (Application) 12.2 Global Chip Level Underfill Adhesives Market Sales by Application (2020-2033) 12.3 Global Chip Level Underfill Adhesives Market Size (M USD) by Application (2020-2033) 12.4 Global Chip Level Underfill Adhesives Sales Growth Rate by Application (2020-2033) 13 Company Profiles 13.1 Henkel 13.1.1 Henkel Company Overview 13.1.2 Henkel Business Overview 13.1.3 Henkel Chip Level Underfill Adhesives Major Product Offerings 13.1.4 Henkel Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.1.5 Key News 13.2 Won Chemical 13.2.1 Won Chemical Company Overview 13.2.2 Won Chemical Business Overview 13.2.3 Won Chemical Chip Level Underfill Adhesives Major Product Offerings 13.2.4 Won Chemical Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.2.5 Key News 13.3 NAMICS 13.3.1 NAMICS Company Overview 13.3.2 NAMICS Business Overview 13.3.3 NAMICS Chip Level Underfill Adhesives Major Product Offerings 13.3.4 NAMICS Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.3.5 Key News 13.4 Showa Denko 13.4.1 Showa Denko Company Overview 13.4.2 Showa Denko Business Overview 13.4.3 Showa Denko Chip Level Underfill Adhesives Major Product Offerings 13.4.4 Showa Denko Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.4.5 Key News 13.5 Panasonic 13.5.1 Panasonic Company Overview 13.5.2 Panasonic Business Overview 13.5.3 Panasonic Chip Level Underfill Adhesives Major Product Offerings 13.5.4 Panasonic Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.5.5 Key News 13.6 MacDermid (Alpha Advanced Materials) 13.6.1 MacDermid (Alpha Advanced Materials) Company Overview 13.6.2 MacDermid (Alpha Advanced Materials) Business Overview 13.6.3 MacDermid (Alpha Advanced Materials) Chip Level Underfill Adhesives Major Product Offerings 13.6.4 MacDermid (Alpha Advanced Materials) Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.6.5 Key News 13.7 Shin-Etsu 13.7.1 Shin-Etsu Company Overview 13.7.2 Shin-Etsu Business Overview 13.7.3 Shin-Etsu Chip Level Underfill Adhesives Major Product Offerings 13.7.4 Shin-Etsu Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.7.5 Key News 13.8 Sunstar 13.8.1 Sunstar Company Overview 13.8.2 Sunstar Business Overview 13.8.3 Sunstar Chip Level Underfill Adhesives Major Product Offerings 13.8.4 Sunstar Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.8.5 Key News 13.9 Fuji Chemical 13.9.1 Fuji Chemical Company Overview 13.9.2 Fuji Chemical Business Overview 13.9.3 Fuji Chemical Chip Level Underfill Adhesives Major Product Offerings 13.9.4 Fuji Chemical Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.9.5 Key News 13.10 Zymet 13.10.1 Zymet Company Overview 13.10.2 Zymet Business Overview 13.10.3 Zymet Chip Level Underfill Adhesives Major Product Offerings 13.10.4 Zymet Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.10.5 Key News 13.11 Shenzhen Dover 13.11.1 Shenzhen Dover Company Overview 13.11.2 Shenzhen Dover Business Overview 13.11.3 Shenzhen Dover Chip Level Underfill Adhesives Major Product Offerings 13.11.4 Shenzhen Dover Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.11.5 Key News 13.12 Threebond 13.12.1 Threebond Company Overview 13.12.2 Threebond Business Overview 13.12.3 Threebond Chip Level Underfill Adhesives Major Product Offerings 13.12.4 Threebond Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.12.5 Key News 13.13 AIM Solder 13.13.1 AIM Solder Company Overview 13.13.2 AIM Solder Business Overview 13.13.3 AIM Solder Chip Level Underfill Adhesives Major Product Offerings 13.13.4 AIM Solder Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.13.5 Key News 13.14 Darbond Technology 13.14.1 Darbond Technology Company Overview 13.14.2 Darbond Technology Business Overview 13.14.3 Darbond Technology Chip Level Underfill Adhesives Major Product Offerings 13.14.4 Darbond Technology Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.14.5 Key News 13.15 Master Bond 13.15.1 Master Bond Company Overview 13.15.2 Master Bond Business Overview 13.15.3 Master Bond Chip Level Underfill Adhesives Major Product Offerings 13.15.4 Master Bond Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.15.5 Key News 13.16 Hanstars 13.16.1 Hanstars Company Overview 13.16.2 Hanstars Business Overview 13.16.3 Hanstars Chip Level Underfill Adhesives Major Product Offerings 13.16.4 Hanstars Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.16.5 Key News 13.17 Nagase ChemteX 13.17.1 Nagase ChemteX Company Overview 13.17.2 Nagase ChemteX Business Overview 13.17.3 Nagase ChemteX Chip Level Underfill Adhesives Major Product Offerings 13.17.4 Nagase ChemteX Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.17.5 Key News 13.18 LORD Corporation 13.18.1 LORD Corporation Company Overview 13.18.2 LORD Corporation Business Overview 13.18.3 LORD Corporation Chip Level Underfill Adhesives Major Product Offerings 13.18.4 LORD Corporation Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.18.5 Key News 13.19 Asec Co. 13.19.1 Asec Co. Company Overview 13.19.2 Asec Co. Business Overview 13.19.3 Asec Co. Chip Level Underfill Adhesives Major Product Offerings 13.19.4 Asec Co. Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.19.5 Key News 13.20 Ltd. 13.20.1 Ltd. Company Overview 13.20.2 Ltd. Business Overview 13.20.3 Ltd. Chip Level Underfill Adhesives Major Product Offerings 13.20.4 Ltd. Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.20.5 Key News 13.21 Everwide Chemical 13.21.1 Everwide Chemical Company Overview 13.21.2 Everwide Chemical Business Overview 13.21.3 Everwide Chemical Chip Level Underfill Adhesives Major Product Offerings 13.21.4 Everwide Chemical Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.21.5 Key News 13.22 Bondline 13.22.1 Bondline Company Overview 13.22.2 Bondline Business Overview 13.22.3 Bondline Chip Level Underfill Adhesives Major Product Offerings 13.22.4 Bondline Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.22.5 Key News 13.23 Panacol-Elosol 13.23.1 Panacol-Elosol Company Overview 13.23.2 Panacol-Elosol Business Overview 13.23.3 Panacol-Elosol Chip Level Underfill Adhesives Major Product Offerings 13.23.4 Panacol-Elosol Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.23.5 Key News 13.24 United Adhesives 13.24.1 United Adhesives Company Overview 13.24.2 United Adhesives Business Overview 13.24.3 United Adhesives Chip Level Underfill Adhesives Major Product Offerings 13.24.4 United Adhesives Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.24.5 Key News 13.25 U-Bond 13.25.1 U-Bond Company Overview 13.25.2 U-Bond Business Overview 13.25.3 U-Bond Chip Level Underfill Adhesives Major Product Offerings 13.25.4 U-Bond Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.25.5 Key News 13.26 Shenzhen Cooteck Electronic Material Technology 13.26.1 Shenzhen Cooteck Electronic Material Technology Company Overview 13.26.2 Shenzhen Cooteck Electronic Material Technology Business Overview 13.26.3 Shenzhen Cooteck Electronic Material Technology Chip Level Underfill Adhesives Major Product Offerings 13.26.4 Shenzhen Cooteck Electronic Material Technology Chip Level Underfill Adhesives Sales and Revenue fromChip Level Underfill Adhesives (2020-2025) 13.26.5 Key News 13.26.6 Key News 14 Key Market Trends, Opportunity, Drivers and Restraints 14.1 Key Takeway 14.2 Market Opportunities & Trends 14.3 Market Drivers 14.4 Market Restraints 14.5 Market Major Factor Assessment 14.6 Porter's Five Forces Analysis of Chip Level Underfill Adhesives Market 14.7 PEST Analysis of Chip Level Underfill Adhesives Market 15 Analysis of the Chip Level Underfill Adhesives Industry Chain 15.1 Overview of the Industry Chain 15.2 Upstream Segment Analysis 15.3 Midstream Segment Analysis 15.3.1 Manufacturing, Processing or Conversion Process Analysis 15.3.2 Key Technology Analysis 15.4 Downstream Segment Analysis 15.4.1 Downstream Customer List and Contact Details 15.4.2 Customer Concerns or Preference Analysis 16 Conclusion 17 Appendix 17.1 Methodology 17.2 Research Process and Data Source 17.3 Disclaimer 17.4 Note 17.5 Examples of Clients 17.6 DisclaimerResearch Methodology The research methodology employed in this study follows a structured, four-stage process designed to ensure the accuracy, consistency, and relevance of all data and insights presented. The process begins with Information Procurement, wherein data is collected from a wide range of primary and secondary sources. This is followed by Information Analysis, during which the collected data is systematically mapped, discrepancies across sources are examined, and consistency is established through cross-validation.
Subsequently, the Market Formulation phase involves placing verified data points into an appropriate market context to generate meaningful conclusions. This step integrates analyst interpretation and expert heuristics to refine findings and ensure applicability. Finally, all conclusions undergo a rigorous Validation and Publishing process, where each data point is re-evaluated before inclusion in the final deliverable. The methodology emphasizes bidirectional flow and reversibility between key stages to maintain flexibility and reinforce the integrity of the analysis.
Research Process The market research process follows a structured and iterative methodology designed to ensure accuracy, depth, and reliability. It begins with scope definition and research design, where the research objectives are clearly outlined based on client requirements, emerging market trends, and initial exploratory insights. This phase provides strategic direction for all subsequent stages of the research. Data collection is then conducted through both secondary and primary research. Secondary research involves analyzing publicly available and paid sources such as company filings, industry journals, and government databases to build foundational knowledge. This is followed by primary research, which includes direct interviews and surveys with key industry stakeholders—such as manufacturers, distributors, and end users—to gather firsthand insights and address data gaps identified earlier. Techniques included CATI (Computer-Assisted Telephonic Interviewing), CAWI (Computer-Assisted Web Interviewing), CAVI (Computer-Assisted Video Interviewing via platforms like Zoom and WebEx), and CASI (Computer-Assisted Self Interviewing via email or LinkedIn).
