2025-04-11236 Pages3680 USD
System-in-Package (SiP) technology refers to the integration of multiple integrated circuits (ICs) into a single package, providing a compact and efficient solution for electronic devices. SiP technology enables the combination of different functionalities, such as processors, memory, and sensors, in a smaller form factor compared to traditional methods. This integration offers benefits like reduced power consumption, improved performance, and lower costs, making it an attractive option for various industries including consumer electronics, telecommunications, automotive, and healthcare.
The market for System-in-Package (SiP) technology is experiencing significant growth driven by several key factors. One of the main market trends is the increasing demand for miniaturization and higher fu