2025-05-26207 Pages3680 USD
CMP (Chemical Mechanical Planarization) slurry for semiconductors is a specialized abrasive liquid mixture used in the semiconductor manufacturing process to polish and planarize the surfaces of wafers. It consists of abrasive particles, chemicals, and additives suspended in a liquid carrier. The abrasive particles remove excess material from the wafer surface, while the chemicals and additives help control the polishing process. CMP slurry is a critical component in the production of integrated circuits, as it enables the precise and uniform polishing required for the creation of multiple layers of circuitry on a semiconductor wafer.
The market for CMP slurry for semiconductors is driven by several key factors. Firstly, the increasing demand for smaller, faster, and more powerful semicon