A wafer dicing machine, also known as dicing equipment, is a high-precision device that uses blades or lasers to cut chips. It plays a critical role in semiconductor back-end packaging and testing, specifically in wafer dicing and wafer-level packaging (WLP) dicing processes. The quality and efficiency of dicing directly impact the final packaging quality and cost of chips. Downstream applications include a wide range of semiconductor products such as integrated circuits (ICs), discrete devices, sensors, and optoelectronic components.The global Wafer Dicing Machine market is projected to reach USD 2.04 Billion in 2024. It is expected to grow to USD 3.06 Billion by 2033, registering a compound annual growth rate (CAGR) of 4.61% during the forecast period

The global fiber array market is entering a period of accelerated transformation, driven by structural shifts in data infrastructure, technological integration, and end-user diversification. As the digital economy flourishes, the expansion of hyperscale data centers—fueled by growing demands for artificial intelligence (AI),

Semiconductor Inspection and Metrology Equipment refers to specialized tools used for quality control and performance testing of semiconductor products such as chips and wafers throughout the manufacturing and packaging processes. These tools cover the entire semiconductor value chain, from front-end

Etching is one of the core processes in semiconductor manufacturing—alongside lithography and thin film deposition—and is primarily responsible for removing specific materials to form intricate microstructures. Etching equipment accounts for approximately 22%–25% of the total value of front-end semiconductor manufacturing tools, highlighting its critical role in the industry. According to LookWhole Insight, the global Semiconductor Etch Equipment market is projected to reach USD 23.83 Billion in 2024. It is expected to grow to USD 47.03 Billion by 2033, register-ing a compound annual growth rate (CAGR) of 7.85% during the forecast period (2025–2033).

An optical module, formally known as an Optical Transceiver, is a core component in optical communications. It enables the conversion between optical and electrical signals. The module consists of optoelectronic devices, functional circuits, and optical interfaces, with the optoelectronic devices comprising both transmitting and receiving units.

From the perspective of hardware architecture, AI servers mainly refer to servers in heterogeneous form, and most of them are rack-mounted. In terms of heterogeneous mode, it can be CPU+GPU, CPU+FPGA, CPU+TPU, CPU+ASIC or CPU+multiple acceleration cards.

Electronic Design Automation (EDA) refers to a comprehensive suite of computer-aided tools used for the design, simulation, and verification of integrated circuits (ICs). As a core upstream technology in the semiconductor value chain, EDA significantly improves chip development efficiency and reduces design complexity. The level of EDA technology directly determines chip performance and the overall innovation capacity of the industry.