2024-10-28239 Pages3680 USD
LTCC (Low-Temperature Co-Fired Ceramic) and HTCC (High-Temperature Co-Fired Ceramic) are advanced ceramic technologies used in the manufacturing of electronic components and devices. LTCC technology involves the co-firing of multiple layers of ceramic tapes at relatively low temperatures, typically below 1,000°C, while HTCC technology requires higher firing temperatures, usually above 1,000°C. These technologies offer excellent electrical properties, high thermal conductivity, and good mechanical strength, making them ideal for applications in the aerospace, automotive, telecommunications, and medical industries. LTCC is more suitable for applications requiring miniaturization and high-frequency performance, while HTCC is preferred for high-power applications due to its ability to withstan